An FTIR spectrometer for remote measurements of atmospheric composition

The JPL IV interferometer, and infrared Michelson interferometer, was built specifically for recording high resolution solar absorption spectra from remote ground-based sites, aircraft and from stratospheric balloons. The instrument is double-passed, with one fixed and one moving corner reflector, allowing up to 200-cm of optical path difference (corresponding to an unapodised spectral resolution of 0.003/cm). The carriage which holds the moving reflector is driven by a flexible nut riding on a lead screw. This arrangement, together with the double-passed optical scheme, makes the instrument resistant to the effects of mechanical distortion and shock. The spectral range of the instrument is covered by two liquid nitrogen-cooled detectors: an InSb photodiode is used for the shorter wavelengths (1.85 to 5.5 microns, 1,800 to 5,500/cm) and a HgCdTe photoconductor for the range (5.5 to 15 microns, 650 to 1,800/cm). For a single spectrum of 0.01/cm resolution, which requires a scan time of 105 seconds, the signal/noise ratio is typically 800:1 over the entire wavelength range

Floating plate capacitor with extremely wide band low impedance

Describes a capacitor that exhibits high two-port insertion loss even at frequencies as high as 10 GHz. Notably, the capacitor exhibits an insertion loss of more than -40 dB over a range from 1 GHz to 10 GHz and no inductive resonance below a frequency of at least 1 GHz

Electronic interconnection medium having offset electrical mesh plane

Describes an electrical interconnection medium having first and second overlying interconnection layers. Each interconnection layer includes parallel conductors, and the conductors of the first and second interconnection layers are oriented orthogonally to each other. The conductors can be interconnected to form at least two electrical planes, with the conductors of the electrical planes being substantially interdigitated on each interconnection layer, portions of each plane appearing on both layers. The interconnection medium is advantageously employed as a multichip module. A method of designing such an MCM includes providing arranged conductive regions in a spaced manner, cutting selected sections to form signal conductor paths, and then filling spaces between like power and ground conductors. Another embodiment provides arranging touching conductive regions, defining signal path areas along uniformly-spaced touching borders, and then carving away conductive material to form desirably positioned and spaced power, ground and signal conductors

Multichip module and method of forming same

Describes an electrical interconnection medium having first and second overlying interconnection layers. Each interconnection layer includes parallel conductors, and the conductors of the first and second interconnection layers are oriented orthogonally to each other. The conductors can be interconnected to form at least two electrical planes, with the conductors of the electrical planes being substantially interdigitated on each interconnection layer, portions of each plane appearing on both layers. The interconnection medium is advantageously employed as a multichip module. A method of designing such an MCM includes providing arranged conductive regions in a spaced manner, cutting selected sections to form signal conductor paths, and then filling spaces between like power and ground conductors. Another embodiment provides arranging touching conductive regions, defining signal path areas along uniformly-spaced touching borders, and then carving away conductive material to form desirably positioned and spaced power, ground and signal conductors

Method of making capacitor with extremely wide band low impedance

A capacitor having a floating plate-shaped electrode, at least two patterned plate electrodes overlying the floating plate-shaped electrode, and a dielectric layer between, is described. The resulting structure exhibits high two-part insertion loss even at frequencies as high as 10 GHz. Notably, the capacitor exhibits an insertion loss of more than -40 dB over a range from 1 GHz to 10 GHz

Multichip module and method of fabrication therefor

Describes an electrical interconnection medium having first and second interconnection layers, each interconnection layer including parallel conductors, the conductors of the first and second interconnection layers being oriented orthogonal to each other and being interconnected so as to form substantially interdigitated power distribution planes on each layer, each plane appearing on both layers. The interconnection medium advantageously is employed as a multichip module

Apparatus and method for providing low-loss transmission lines in interconnected mesh plane systems

Describes an interconnected mesh plane system that includes at least a pair of adjacent metal layers separated by dielectric, each layer having a plurality of spaced power, ground, and signal conductors extending in the same direction, with the conductors of one layer of the pair transverse to the conductors of the other layer, and with conductors of one layer connected to corresponding conductors of the other layer. The width of at least one signal conductor is increased to reduce signal loss, and the width of spaces between such a signal conductor and adjacent power and/or ground conductors is increased to provide a predetermined desired characteristic impedance of a transmission line that includes such a signal conductor

Floating plate capacitor with extremely wide band low impedance

Describes a capacitor having a floating plate-shaped electrode with at least two patterned plate electrodes overlying the floating plate-shaped electrode, and a dielectric layer between. The resulting structure exhibits high two-part insertion loss even at frequencies as high as 10 GHz. Notably, the capacitor exhibits an insertion loss of more than -40 dB over a range from 1 GHz to 10 GHz